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| Micron Cleaving - SELA (ISRAEL) |
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MC600 可做為SEM試片準備工具，利用晶格批裂原理可以達到良好的切割面。有別於傳統研磨方式。
• Fully automatic process - 9 minutes.
• Fast Cleave - in 3 minutes.
• Accuracy better than 0.5 μm.
• High Cleaving Quality for LowK and Cu.
• Different Substrates: Si, GaAs, InP.
• One day training.
• Minimum Maintenance Costs. |
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工作原理
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| SELA(TEM sample preparation, SEM sample preparation, micron cleaving),MC-600-SEM試片準備機 |
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